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A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis Liu, Jinhong; Hua, Yaling; Liu, Junfu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, SURFACES AND INTERFACES, v.44, 2024-01 |
Ta-base 비정질 박막의 Cu 확산 방지 특성에 관한 연구 = A study on the barrier property of Ta-base amorphous thin film against Cu diffusionlink 이윤직; Lee, Yoon-Jik; et al, 한국과학기술원, 1998 |
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