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Showing results 1 to 3 of 3

1
Enhancement of iodine adsorption on ruthenium glue layer for seedless CECVD of Cu

Lee, HB; Kwak, DK; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.8, no.2, pp.C39 - C42, 2005

2
Interfacial band-edge engineered TiO2 protection layer on Cu2O photocathodes for efficient water reduction reaction

Choi, Jaesuk; Song, Jun Tae; Jang, Ho Seong; Choi, Min-Jae; Sim, Dong Min; Yim, Soonmin; Lim, Hunhee; et al, ELECTRONIC MATERIALS LETTERS, v.13, no.1, pp.57 - 65, 2017-01

3
PEALD of a ruthenium adhesion layer for copper interconnects

Kwon, OK; Kwon, SH; Park, HS; Kang, SW, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.12, pp.C753 - C756, 2004

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