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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

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Park, YS / Kwon, YM / Moon, JT / Lee, YW / Lee, JH / Paik, Kyung-Wookresearcher
Publisher
ECTC
Issue Date
2010-06-01
Language
English
Citation

60th Electronic Components and Technology Conference, ECTC 2010, pp.1436 - 1441

ISSN
0569-5503
URI
http://hdl.handle.net/10203/164467
Appears in Collection
MS-Conference Papers(학술회의논문)
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