A Neural Network Approach to the Inspection of Ball Grid Ar Solder Joints on Printed Circuit Boards

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dc.contributor.authorKo, Kuk Won-
dc.contributor.authorRoh, Young Jun-
dc.contributor.authorCho, Hyungsuck-
dc.contributor.authorKimn, Hyung Cheol-
dc.date.accessioned2007-10-04T02:46:31Z-
dc.date.available2007-10-04T02:46:31Z-
dc.date.created2012-02-06-
dc.date.issued2000-
dc.identifier.citationIJCNN'2000, v., no., pp.233 - 238-
dc.identifier.urihttp://hdl.handle.net/10203/1623-
dc.languageENG-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleA Neural Network Approach to the Inspection of Ball Grid Ar Solder Joints on Printed Circuit Boards-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage233-
dc.citation.endingpage238-
dc.citation.publicationnameIJCNN'2000-
dc.contributor.localauthorCho, Hyungsuck-
dc.contributor.nonIdAuthorKo, Kuk Won-
dc.contributor.nonIdAuthorRoh, Young Jun-
dc.contributor.nonIdAuthorKimn, Hyung Cheol-

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