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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Thermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)

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dc.contributor.authorJang T.-Y.-
dc.contributor.authorHa C.-W.-
dc.contributor.authorKim, Kyung-Soo-
dc.date.accessioned2013-03-26T01:25:59Z-
dc.date.available2013-03-26T01:25:59Z-
dc.date.created2012-02-06-
dc.date.issued2009-11-17-
dc.identifier.citation2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, v., no., pp.113 - 117-
dc.identifier.urihttp://hdl.handle.net/10203/156759-
dc.languageENG-
dc.titleThermosonic flip chip bonding using lateral vibration with anisotropic conductive film (ACF)-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77949356595-
dc.type.rimsCONF-
dc.citation.beginningpage113-
dc.citation.endingpage117-
dc.citation.publicationname2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorKim, Kyung-Soo-
dc.contributor.nonIdAuthorJang T.-Y.-
dc.contributor.nonIdAuthorHa C.-W.-
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ME-Conference Papers(학술회의논문)
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