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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability

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Park, YS / Kwon, YM / Moon, JT / Lee, YW / Lee, JH / Paik, Kyung-Wookresearcher
Issue Date
2009-12-09
Language
ENG
Citation

2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.321 - 324

URI
http://hdl.handle.net/10203/156243
Appears in Collection
MS-Conference Papers(학술회의논문)
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