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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Wafer level ACA packages and their applications to advanced electronic packaging

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Paik, Kyung-Wookresearcher / Son, HY / Kim, I / Chung, CK
Publisher
123
Issue Date
2008-12-09
Language
English
Citation

10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456

URI
http://hdl.handle.net/10203/153631
Appears in Collection
MS-Conference Papers(학술회의논문)
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