DSpace at KOASAS: Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature

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Nah, JW / Suh, JO / Paik, Kyung-Wook researcher / Tu, KN

Issue Date: 2005-03-16

Language: ENG

Citation: 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53

URI: http://hdl.handle.net/10203/142570

Appears in Collection: MS-Conference Papers(학술회의논문)

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