Effects of heating rate during ACFs curing process on material properties and thermal cycling reliability of flip chip assembly
- Publisher
- IEEE
- Issue Date
- 2007-05-29
- Language
- ENG
- Citation
57th Electronic Components and Technology Conference, 2007, pp.1725 - 1730
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- FC_125.pdf(904.06 kB)Download
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