Flip chip assembly on PCB substrates with coined solder bumps

Publisher
IEEE
Issue Date
2003-05-27
Language
ENG
Citation

53rd Electronic Components and Technology Conference, pp.244 - 249

ISSN
0569-5503
URI
http://hdl.handle.net/10203/1407
Appears in Collection
MS-Conference Papers(학술회의논문)
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