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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPark, TS-
dc.date.accessioned2013-03-17T04:46:51Z-
dc.date.available2013-03-17T04:46:51Z-
dc.date.created2012-02-06-
dc.date.issued2003-
dc.identifier.citationTMA Conference, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/139956-
dc.languageENG-
dc.titleLow cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameTMA Conference-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPark, TS-
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ME-Conference Papers(학술회의논문)
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