DSpace at KOASAS: Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump

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Yim, MJ / Jeon, YD / Paik, Kyung-Wook researcher

Issue Date: 1999-06-13

Language: ENG

Citation: InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26

URI: http://hdl.handle.net/10203/135668

Appears in Collection: MS-Conference Papers(학술회의논문)

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