Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPark, TS-
dc.contributor.authorHam, SJ-
dc.date.accessioned2013-03-16T15:51:18Z-
dc.date.available2013-03-16T15:51:18Z-
dc.date.created2012-02-06-
dc.date.issued1999-
dc.identifier.citationInternational Conference on Advanced Technology in Experimental Mechanics, ATEM'99, v., no., pp.661 - 666-
dc.identifier.urihttp://hdl.handle.net/10203/132836-
dc.languageENG-
dc.titleExperimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage661-
dc.citation.endingpage666-
dc.citation.publicationnameInternational Conference on Advanced Technology in Experimental Mechanics, ATEM'99-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPark, TS-
dc.contributor.nonIdAuthorHam, SJ-
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ME-Conference Papers(학술회의논문)
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