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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI)

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Jang, W / Lee, BW / Kim, DW / Nah, JW / Paik, Kyung-Wookresearcher / Kwon, D
Issue Date
2001-11
Language
ENG
Citation

Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314

URI
http://hdl.handle.net/10203/132002
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MS-Conference Papers(학술회의논문)
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