Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications

In this paper, thermomechanical and theological properties of nonconductive pastes (NCPs) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermomechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature (T-g) and storage modulus at room temperature became higher while coefficient of thermal expansion (CTE) decreased. On the other hand, theological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermomechanical properties such as modulus, CTE, and T-g. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected and used as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2004-09
Language
ENG
Keywords

CONDUCTIVE ADHESIVE JOINTS; COMPOSITES; SUBSTRATE

Citation

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.27, pp.608 - 615

ISSN
1521-3331
DOI
10.1109/TCAPT.2004.832054
URI
http://hdl.handle.net/10203/1241
Appears in Collection
MS-Journal Papers(저널논문)
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