Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability

Publisher
IEEE
Issue Date
2006-05-30
Language
ENG
Citation

IEEE 56th Electronic Components and Technology Conference, pp.952 - 958

URI
http://hdl.handle.net/10203/1236
Appears in Collection
MS-Conference Papers(학술회의논문)
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