Wafer level package using pre-applied Anisotropic Conductive Films (ACFs) for flip-chip interconnections

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 881
  • Download : 1204
Publisher
IEEE
Issue Date
2006-05-30
Language
ENG
Citation

IEEE 56th Electronic Components and Technology Conference, pp.565 - 569

URI
http://hdl.handle.net/10203/1226
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
FC_111.pdf(846.57 kB)Download

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0