Planarization and trench filling on severe surface topography with thick photoresist for MEMS

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Issue Date
1998-09-21
Language
ENG
Citation

the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, v.3511, pp.297 - 306

URI
http://hdl.handle.net/10203/117934
Appears in Collection
EE-Conference Papers(학술회의논문)
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