Planarization and trench filling on severe surface topography with thick photoresist for MEMS
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yoon, Jun-Bo | ko |
| dc.contributor.author | Oh, G.Y. | ko |
| dc.contributor.author | Han, Chul-Hi | ko |
| dc.contributor.author | Yoon, Euisik | ko |
| dc.contributor.author | Kim, Choong Ki | ko |
| dc.date.accessioned | 2013-03-15T08:39:51Z | - |
| dc.date.available | 2013-03-15T08:39:51Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-09-21 | - |
| dc.identifier.citation | the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining, pp.297 - 306 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/117934 | - |
| dc.language | English | - |
| dc.publisher | SPIE | - |
| dc.title | Planarization and trench filling on severe surface topography with thick photoresist for MEMS | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000076937000033 | - |
| dc.identifier.scopusid | 2-s2.0-0038674730 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 297 | - |
| dc.citation.endingpage | 306 | - |
| dc.citation.publicationname | the SPIE symposium on Micromachining and Microfabrication: Materials and Device Characterization in micromachining | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Santa Clara, CA | - |
| dc.contributor.localauthor | Yoon, Jun-Bo | - |
| dc.contributor.localauthor | Han, Chul-Hi | - |
| dc.contributor.localauthor | Yoon, Euisik | - |
| dc.contributor.nonIdAuthor | Oh, G.Y. | - |
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