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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of Humidity Cycling on Polymer Overlaid High Density Interconnects

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Paik, Kyung-Wookresearcher / Li, X / Pecht, M / Bernard, E
Issue Date
1993-10-01
Language
ENG
Citation

Proceeding of IEEE-CHMT VLSI packaging workshop, pp.11 - 13

URI
http://hdl.handle.net/10203/104915
Appears in Collection
MS-Conference Papers(학술회의논문)
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