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Showing results 213401 to 213420 of 279418

213401
Vertical laminar flow-based immunoassay using a simultaneous diffusion-driven immune reaction

Kurmashev, Amanzhol; 권세용; 박제균; 강주헌, 한국바이오칩학회 2018 추계학술발표회, 한국바이오칩학회, 2018-11-08

213402
Vertical leg stiffness in the single support phase and dynamic model leg stiffness shows similar to trends

Hong, Hyun-hwa; Park, Sukyung, International Symposium on Nature-Inspired Technology, KSME, KIMM, KIST, 2012-01-09

213403
Vertical Light Coupling from Planar Artificial Compound Eyes

Keum, Dong Min; Jeong, KI-HUN, ISNIT 2010, 2010-10-15

213404
Vertical micromirror fabricated in (110) silicon device layer by combination of KOH and DRIE etch

Yu, Kyoungsik; Lee, D.; Solgaard, O., Lasers and Electro-Optics Society, 2004. LEOS 2004. The 17th Annual Meeting of the IEEE, v.2, pp.531 - 532, IEEE/LEOS International Conference on Optical MEMS, 2004-11-07

213405
Vertical Mirror Fabrication Combining KOH Etch and DRIE of (110) Silicon

Lee, D; Yu, Kyoungsik; Krishnamoorthy, U; Solgaard, O, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.18, no.1, pp.217 - 227, 2009-02

213406
Vertical multi-stacked electromagnetic bandgap structure for power/ground noise isolation in the multi-layer package and printed circuit board = 다층 패키지 및 PCB에서의 전력/접지 잡음 억제를 위한 수직의 다층 적층 EBG 구조link

Yoo, Jeong-Sik; 유정식; et al, 한국과학기술원, 2009

213407
Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC

Koo, Kyoung-Choul; Kim, Myung-Hoi; Kim, Jonghoon J.; Kim, Joung-Ho; Kim, Ji-Seong, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.3, pp.476 - 488, 2013-03

213408
Vertical Noise Coupling from On-chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3D-IC

Koo, Kyoungchoul; Kim, Myunghoi; Kim, Joungho, DesignCon2012, DesignCon2012, 2012-02-01

213409
Vertical Noise Coupling on Wideband Low Noise Amplifier from On-chip Switching-Mode DC-DC Converter in 3D-IC

Koo, Kyoungchoul; Lee, Sangrok; Kim Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC 2011, 2011-11-07

213410
Vertical order of DPPC multilayer enhanced by cholesterol-induced ripple-to-liquid ordered (LO) phase transition: Synchrotron X-ray reflectivity study

Lee, Suho; Jeong, Dae-Woong; Choi, Myung-Chul, CURRENT APPLIED PHYSICS, v.17, no.3, pp.392 - 397, 2017-03

213411
Vertical Partitioing of Row-Based Circuits with Minimal Net-Crossings

Park, In-Cheol; Kyung, Chong-Min, IEEE International Sympoisum on Circuits and Systems, 1991-06

213412
Vertical Position Error Bounding for Integrated GPS/Barometer Sensors to Support Unmanned Aerial Vehicle (UAV)

Lee, Jinsil; Hyeon, Eunjeong; Kim, Minchan; Lee, Jiyun, 30th Congress of the International Council of the Aeronautical Sciences, International Council of the Aeronautical Sciences (ICAS), 2016-09

213413
Vertical Position Error Bounding for Integrated Sensors to Support Unmanned Aerial Vehicles (UAV)

Lee, Jinsil; Pullen, Sam; Lee, Jiyun, SCPNT 2015, Stanford University, 2015-11

213414
Vertical Protection Level Derivation of Multi-sensor Integrated LAD-GNSS for UAV Applications

Lee, Jinsil; Lee, Jiyun, International Technical Symposium on Navigation and Timing (ITSNT 2017), the Centre National d’Etudes Spatiales (CNES) / Ecole Nationale de l'Aviation Civile (ENAC), 2017-11

213415
Vertical Protection Level Derivation of Multi-sensor Integrated LAD-GNSS for UAV Applications

Lee, Jinsil; Lee, Jiyun, International Technical Symposium on Navigation and Timing (ITSNT 2017), International Technical Symposium on Navigation and Timing (ITSNT), 2017-11-14

213416
Vertical scale height of the topside ionosphere around the Korean Peninsula: Estimates from ionosondes and the Swarm constellation

Park, Jaeheung; Kwak, Youngsil; Mun, Junchul; Min, Kyoung-Wook, JOURNAL OF ASTRONOMY AND SPACE SCIENCES, v.32, no.4, pp.311 - 315, 2015-12

213417
Vertical Segmentation and Geo-registration of Individual Building Images from Wide-baseline Panoramic Image Sequences using a Digital map Reference

Kim, Hyung Ki; Han, Soon Hung, World IT Congress 2015, World Congress on Information Technology Applications and Services(WITC), 2015-02-25

213418
Vertical Single-Walled Carbon Nanotube Arrays via Block Copolymer Lithography

Lee, Duck Hyun; Lee, Won-Jong; Kim, Sang Ouk, CHEMISTRY OF MATERIALS, v.21, no.7, pp.1368 - 1374, 2009-04

213419
Vertical Single-Walled Carbon Nanotube Arrays via Block Copolymer Lithography

Lee, Duck Hyun; Lee, Won Jong; Kim, Sang Ouk, Chemistry of Materials, Vol.21, pp.1368-1374, 2009

213420
Vertical stacking of three-dimensional nanostructures via an aerosol lithography for advanced optical applications

Lee, Kiwoong; Choi, Hoseop; Kim, Dae Seong; Jang, Min Seok; Choi, Mansoo, NANOTECHNOLOGY, v.28, no.47, 2017-10

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