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Showing results 63173 to 63192 of 74251

63173

W 에 의한 Mo 치환이 850℃ 에서 시효된 이상 스테인레스강의 취화 특성에 미치는 영향

김상범; 백경욱researcher; 김영길대한금속·재료학회대한금속·재료학회지, v.35, no.12, pp.1593 - 1601, 1997-12

63174

W(CO)5(L)-Catalyzed Endo-Selective Cyclization of Allenyl Silyl Enol Ethers: An Efficient Method for the Cyclopentene Annulation onto a,b-Unsaturat

Kim, Sung GakresearcherAmer Chemical SocORGANIC LETTERS, v.5, no.10, pp.1725 - 1728, 2003-05

63175

W-incorporated CoMo/gamma-Al2O3 hydrodesulfurization catalyst .2. Characterization

Lee, DK; Lee, HT; Lee, IC; Park, SK; Bae, SY; Kim, CH; Woo, Seong-IhlresearcherACADEMIC PRESS INC JNL-COMP SUBSCRIPTIONSJOURNAL OF CATALYSIS, v.159, no.1, pp.219 - 229, 1996-03

63176

W-Ni-Fe중합금에서 칼슘이나 란타늄 첨가에 따른 황과 인에 의한 취화의 제거

홍성현; 강석중researcher; 윤덕용대한금속·재료학회대한금속·재료학회지, v.29, no.9, pp.925 - 932, 1991-01

63177

W2F2Q: Packet fair queuing in wireless packet networks

Yi, Yung; Seok Y.; Kwon T.; Choi Y.; Park J.ACMACM INTERNATIONAL WORKSHOP ON WIRELESS MOBILE MULTIMEDIA, pp.2 - 10, 2000-07

63178

Wafer distribution system for a clean room using a novel magnetic suspension technique

Park, KH; Ahn, KY; Kim, Soohyunresearcher; Kwak, Yoon KeunresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE-ASME TRANSACTIONS ON MECHATRONICS, v.3, no.1, pp.73 - 78, 1998-03 View PDF (181kb)

63179

Wafer Surface Scanner를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정

배귀남; 박승오researcher; 이춘식; 명현국; 신흥태대한설비공학회설비공학논문집, v.5, no.2, pp.130 - 140, 1993-05

63180

Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

63181

Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

Son, HY; Chung, CK; Yim, MJ; Hwang, JS; Paik, Kyung-Wookresearcher; Jung, GJ; Lee, JKIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, no.3, pp.221 - 227, 2007-07 View PDF (1734kb)

63182

Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections

Kim, Il; Jang, Kyung-Woon; Son, Ho-Young; Kim, Jae-Han; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.5, pp.792 - 797, 2011-05

63183

Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection

Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-WookresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11

63184

Wafer-scale controlled Au/Pt bimetallic flowerlike structure array

Huang, Xing-Jiu; Kim, Ju-Hyun; Choi, Yang-KyuresearcherWORLD GOLD COUNCILGOLD BULLETIN, v.41, no.1, pp.58 - 65, 2008-04

63185

Wafer-scale crack-free AlGaN on GaN through two-step selective-area growth for optically pumped stimulated emission

Ko, Young-Ho; Bae, Sung-Bum; Kim, Sung-Bock; Kim, Dong Churl; Leem, Young Ahn; Cho, Yong-Hoonresearcher; Nam, Eun-SooELSEVIER SCIENCE BVJOURNAL OF CRYSTAL GROWTH, v.445, pp.78 - 83, 2016-07

63186

Wafer-Scale Fabrication and Characterization of Thin-Film Transistors with Polythiophene-Sorted Semiconducting Carbon Nanotube Networks

Liyanage, Luckshitha Suriyasena; Lee, Hangwoo; Patil, Nishant; Park, Steveresearcher; Mitra, Subhasish; Bao, Zhenan; Wong, Hon Sum PhilipAMER CHEMICAL SOCACS NANO, v.6, no.1, pp.451 - 458, 2012-01

63187

Wageningen B-Series 프로펠러의 최적 선택방법

한순흥researcher한국기계연구원한국기계연구원 연구논문집 , v.2, no.1, pp.1 - 6, 1979-11

63188

The Waiting Time Analysis of A Discrete Time Queue with Arrivals as A Discrete Autoregressive Process of Order 1

HWANG, GANG UK; CHOI, BONG DAE; KIM, JAE-KYOONApplied Probability TrustJournal of Applied Probability, 2002 View PDF (247kb)

63189

Waiting-time distribution of a discrete-time multiserver queue with correlated arrivals and deterministic service times: D-MAP/D/k system

Chaudhry, ML; Yoon, BK; Chae, Kyung-ChulresearcherELSEVIER SCIENCE BVOPERATIONS RESEARCH LETTERS, v.30, no.3, pp.174 - 180, 2002-06 View PDF (272kb)

63190

WAKE CHARACTERISTICS OF 3-PHASE FLUIDIZED-BEDS

BAKER, CGJ; Kim, Sang Doneresearcher; BERGOUGNOU, MAELSEVIER SCIENCE SA LAUSANNEPOWDER TECHNOLOGY, v.18, no.2, pp.201 - 207, 1977-03

63191

Wake Characteristics of Vane-Type Vortex Generators in a Flat Plate Laminar Boundary Layer

Shim, Ho-Joon; Jo, Young-Hee; Chang, Kyoungsik; Kwon, Ki-Jung; Park, Seung-OresearcherKOREAN SOC AERONAUTICAL & SPACE SCIENCESINTERNATIONAL JOURNAL OF AERONAUTICAL AND SPACE SCIENCES, v.16, no.3, pp.325 - 338, 2015-09

63192

Wake Effects of Free-Wake Model on Aeroelastic Behavior of Hovering Rotors

Yoo, Seung-Jae; Jeong, Min-Soo; Lee, InresearcherAMER INST AERONAUT ASTRONAUTJOURNAL OF AIRCRAFT, v.48, no.4, pp.1184 - 1192, 2011-07

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