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Showing results 74021 to 74040 of 275607
| Effects of cross talk in WDM system using spectrum-sliced light sources Jang, Y.S.; Lee, Chang-Hee; Chung, Yun Chur, Proceedings of the 1998 Optical Fiber Communication Conference, OFC'98, pp.128 - 129, Optical Fiber Communication Conference, 1998-02-22 |
| Effects of cross-section geometry on the thermal performance of a micro pulsating heat pipe = 채널 단면형상이 마이크로 진동형 히트파이프의 열성능에 미치는 영향link Park, Sung-Wan; 박성완; et al, 한국과학기술원, 2014 |
| Effects of cross-section geometry on the thermal performance of a pulsating heat pipe Kim, Sung Jin; Lee, Jungseok, First Thermal and Fluids Engineering Summer Conference, ASTFE, 2015-08-11 |
| Effects of crosstalk in WDM systems using spectrum-sliced light sources Jang, YS; Lee, Chang-Hee; Chung, YC, IEEE PHOTONICS TECHNOLOGY LETTERS, v.11, no.6, pp.715 - 717, 1999-06 |
| Effects of Crowding and Confinement of Enzyme in Mesoporous Silicates on Thermal Stability = 메조포러스 실리카에 효소의 고정화로 Confinement Effect 와 Crowding Effect 에 의한 효소의 열적 안정성 향상link Shin, Su-jeong; 신수정; Park, Hyun-gyu; 박현규; et al, 한국과학기술원, 2008 |
| Effects of Cryo-Milling and Milling Time on the Microstructures of Oxide-Dispersion Strengthened CoCrFeMnNi High-Entropy Alloy Powder 정승혁; 류호진, 한국원자력학회 2018 추계학술발표회, 한국원자력학회, 2018-10-25 |
| Effects of Crystallinity and Molecular Weight on the Melting Behavior and Cell Morphology of Expanded Polypropylene in Bead Foam Manufacturing Jang, Byung Kak; Kim, Mun Ho; Park, O. Ok, MACROMOLECULAR RESEARCH, v.28, no.4, pp.343 - 350, 2020-04 |
| Effects of CsF Post-deposition Treatment on Cu(In, Ga)Se2 Thin Films and Solar Cells Lee, Hojin; Kim, Kihwan; Jang, Yuseong; Nam, Seong-Wook; Shin, Byungha, 46th IEEE Photovoltaic Specialists Conference, PVSC 2019, pp.622 - 625, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Effects of Cu addition on the creep rupture properties of a 12% Cr steel Ku, BS; Yu, Jin, SCRIPTA MATERIALIA, v.45, no.2, pp.205 - 211, 2001-07 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Effects of Cu diffusion on MOSFET electrical properties Cho, Byung Jin; Zhu, C; Yoo, WJ; Tan, DPP; Lim, SY, 18th International VLSI Multilevel Interconnection Conf. (VMIC), pp.0 - 0, 2001-11-28 |
| Effects of Cu on the Localized Corrosion and Repassivation Kinetics of Fe-20Cr-xCu (x=0, 1, 2 wt. %) Stainless Steels Ahn, SooHoon; Kwon, Hyuk-Sang, Corrosion 2012, NACE International, 2012-03 |
| Effects of Cu on the passive film stability of Fe-20Cr-xCu (x=0, 2,4 wt.%) alloys in H2SO4 solution Oh, Kkoch-Nim; Toor, Ihsan-ul-Haq; Ahn, Soo-Hoon; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.88, pp.170 - 176, 2013-01 |
| Effects of Cu on the Passivity of Cu-containing steels in a dilute H2SO4 solution 오꽃님; 안수훈; 권혁상, 한국부식방식학회 창립 40주년 기념 국제심포지엄 및 2011년도 춘계학술대회, 한국부식방식학회, 2011-04 |
| Effects of Cu substrate morphology and phase control on electrochemical performance of Sn-Ni alloys for Li-ion battery Shin, Na-Ry; Kang, Yong-Mook; Song, Min-Sang; Kim, Dong-Yung; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.186, no.1, pp.201 - 205, 2009-01 |
| Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
| Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, YJ; Paik, Kyung-Wook; Koh, KW; Woon, JH; Choi, SH; Lee, J; et al, Proceeding of the 3rd International Symposium on Electronic Matericals and Packaging 2001, pp.44 - 51, International Symposium on Electronic Matericals and Packaging, 2001-11 |
| Effects of Cu/In Compositional Ratio on the Characteristics of CuInS2 Absorber Layers Prepared by Sulfurization of Metallic Precursors Lee, Seung Hwan; Shin, Seung Wook; Han, Jun Hee; Lee, JeongYong; Kang, Myeong Gil; Agawane, G. L.; Yun, Jae Ho; et al, ELECTRONIC MATERIALS LETTERS, v.8, no.2, pp.191 - 197, 2012-04 |
| Effects of Cu1+/Cu2+ on Properties of Copper Phosphate Glass Bae, Byeong-Soo; Weinberg, MC, pp.352 - 356, 1993-11-01 |
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