Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability

Finer pitch wire bonding technology has been needed since chips have more and finer pitch I/Os. However, finer Au wires are more prone to Au-Al bond reliability and wire sweeping problems when molded with epoxy molding compound. One of the solutions for solving these problems is to add special alloying elements to Au bonding wires. In this study, Cu and Pd were added to Au bonding wire as alloying elements. These alloyed Au bonding wires-Au-1 wt.% Cu wire and Au-1 wt.% Pd wire-were bonded on Al pads and then subsequently aged at 175 degrees C and 200 degrees C. Cu and Pd additions to Au bonding wire slowed down interfacial reactions and crack formation due to the formation of a Cu-rich layer and a Pd-rich layer at the interface. Wire pull testing (WPT) after thermal aging showed that Cu and Pd addition enhanced bond reliability, and Cu was more effective for improving bond reliability than Pd. In addition, comparison between the results of observation of interfacial reactions and WPT proved that crack formation was an important factor to evaluate bond reliability.
Publisher
SPRINGER
Issue Date
2006-11
Language
ENG
Keywords

AL BALL BONDS; GOLD

Citation

JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055

ISSN
0361-5235
URI
http://hdl.handle.net/10203/2846
Appears in Collection
MS-Journal Papers(저널논문)
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