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Showing results 167101 to 167120 of 275665
| Reliability based slope monitoring system considering shallow slope failure induced by rainfall infiltration Lee, Seung Rae; Choi, J.C., ANCRiSST 2008, 2008 |
| Reliability Based Structural Optimal Design Considering Non-normal Distributions of Fatigue Strength KWAK BYUNG MAN, pp.0 - 0, 1992-05-01 |
| Reliability Based Topology Optimization of Rubber Engine Mount Lee, Wan-Sul; Youn, Sung-Kie, the 13th International Pacific Conference on Automotive Engineering, pp.0 - 0, 2005-08 |
| Reliability based wing design optimization using trust region framework Ahn, J.; Kim, S.; Kwon, Jang-Hyuk, Collection of Technical Papers - 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, v.2, pp.1183 - 1196, 2004-08-30 |
| Reliability Based Wing Design Optimization Using Trust Region Framework Ahn, J; Kim, Suwhan; Kwon, Jang-Hyuk, 10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, pp.1 - 14, American Institute of Aeronautics and Astronautics, 2004 |
| Reliability Based Wing Design Optimization Using Trust Region-SQP Framework Kim, S.; Ahn, J.; Kwon, Jang-Hyuk, AIAA/ISSMO Multidisciplinary Analsis and Optimization, 2004 |
| Reliability based wing design optimization using trust-region SQP-framework Kim, Suwhan; Ahn, Joongki; Kwon, Jang-Hyuk, the10th AIAA/ISSMO Multidisciplinary Analysis and Optimization Conference, 2004-08 |
| Reliability bound based on the maximum entropy principle with respect to the first truncated moment Sung, Young Hwa; Kwak, Byung Man, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.24, pp.1891 - 1900, 2010-09 |
| Reliability Characteristics of the Thin Interlevel Poly Silicon Oxide for EEPROM Device Sang-Won Kang, ESC, Extended Abstract, pp.241 -, 1987 |
| Reliability Enhancement of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates by Non-Conducting Filler Additions 백경욱; 임명진, 한국마이크로전자 및 패키징학회지, v.7, no.1, pp.41 - 49, 2000-01 |
| Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) Lee, S; Jang, JM; Lee, WS; Paik, Kyung-Wook, 2009 59th Electronic Components and Technology Conference, ECTC 2009, pp.771 - 776, 2009-05-26 |
| Reliability Estimation of Nuclear Digital I&C System using Software Functional Block Diagram and Control Flow Choi, Jong Gyun; Kang, Hyun Gook; Seong, Tae Yong; Seong, Poong-Hyun, International Symposium on Software Reliability Engineering 2000 (ISSRE2000), 2000-10 |
| Reliability estimation of reduced-order models Kim, Jin-Gyun; Lee, Phill-Seung, 한국소음진동공학회 2014년 춘계학술대회, 한국소음진동공학회, 2014-04-25 |
| Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire Park, JH; Jang, KW; Paik, KW; Lee, Soon-Bok, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638, 123, 2008-12-09 |
| Reliability evaluation for flip-chip electronic packages using optical measurement techniques = 광 측정 기법을 이용한 플립 칩 전자패키지의 신뢰성 평가link Yang, Se-Young; 양세영; et al, 한국과학기술원, 2005 |
| Reliability Evaluation Methodologies of Fault Tolerant Techniques of Digital I&C Systems in Nuclear Power Plants KIM, Bo Gyung; KANG, Hyun Gook; LEE, Seung Jun; Seong, Poong-Hyun, ICI 2011 (ISOFIC + CSEPC +ISSNP), 2011-08-23 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, J.-W.; Suk, K.-L.; Paik, K.-W.; Lee, Soon-Bok, PROCEEDINGS OF SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, v.7522, no.0, pp.0 - 0, 2010 |
| Reliability Evaluation of Solder joints in Electronics Packaging Lee, Soon-Bok, Korea-Usa Electronic Packaging Symposium, pp.110 - 129, 2002 |
| Reliability graph with general gates (RGGG): A novel method for reliability analysis Seong, Poong-Hyun; SHIN, Seung-Ki, INTERNATIONAL ELECTRONIC JOURNAL OF NUCLEAR SAFETY AND SIMULATION, v.1, no.3, pp.180 - 197, 2010-10 |
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