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Showing results 201781 to 201800 of 275771
| Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26 |
| Through Silicon Via (TSV) shielding structures Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25 |
| Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08 |
| Through the Eyes of the User: Evaluating Neonatal Intensive Care Unit Design Denham, Megan E.; Bushehri, Yousef; Lim, Lisa, HERD-HEALTH ENVIRONMENTS RESEARCH & DESIGN JOURNAL, v.11, no.3, pp.49 - 65, 2018-07 |
| Through the time tunnel Lee, Miseong; Nam, Tek-Jin, ACM SIGGRAPH 2008, 2008 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Through-Silicon Via Capacitance-Voltage Hysteresis Modeling for 2.5-D and 3-D IC Kim, Dong-Hyun; Kim, Youngwoo; Cho, Jong-Hyun; Bae, Bumhee; Park, Junyong; Lee, Hyunsuk; Lim, Jaemin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.6, pp.925 - 935, 2017-06 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Through-space charge transfer and emission color tuning of di-o-carborane substituted benzene Bae, Hye Jin; Kim, Hyungjun; Lee, Kang Mun; Kim, Taewon; Lee, Yoon Sup; Do, Youngkyu; Lee, Min Hyung, DALTON TRANSACTIONS, v.43, no.13, pp.4978 - 4985, 2014-04 |
| Through-thickness compressive strength of a carbon/epoxy composite laminate Kim, Byung Chul; Park, Dong Chang; Kim, Byoung Jung; Lee, Dai Gil, COMPOSITE STRUCTURES, v.92, no.2, pp.480 - 487, 2010-01 |
| Through-thickness compressive strength of carbon-phenolic woven composites Park, DC; Lee, Dai Gil, COMPOSITE STRUCTURES, v.70, no.4, pp.403 - 412, 2005-10 |
| Throughflow analysis by Newton-Raphson method for axial flow gas turbines Kim, J.H.; Kim, H.M.; No, Hee Cheon, American Nuclear Society - International Congress on Advances in Nuclear Power Plants 2005, ICAPP'05, v.3, pp.1808 - 1813, 2005-05-15 |
| Throughflow Analysis by Newton-raphson Method for Axial Flow Gas Turbines No, Hee Cheon; Kim, Ji Hwan; Kim, Hyeun Min, 한국원자력학회 추계발표회, 한국원자력학회, 2004 |
| Throughhand: 2d tactile interaction to simultaneously recognize and touch multiple objects Jung, Jingun; Son, Sunmin; Lee, Sangyoon; Kim, Yeonsu; Lee, Geehyuk, 2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths, CHI 2021, pp.1 - 13, Association for Computing Machinery, 2021-05-08 |
| Throughput Analysis Considering Coupling Effect in IEEE 802.11 Networks with Hidden Stations Kim, Tae-Joon; Lim, Jong-Tae, IEEE COMMUNICATIONS LETTERS, v.13, pp.175 - 177, 2009-03 |
| THROUGHPUT ANALYSIS FOR 2 ARQ SCHEMES USING COMBINED TRANSITION MATRIX KIM, SR; Un, Chong-Kwan, IEEE TRANSACTIONS ON COMMUNICATIONS, v.40, no.11, pp.1679 - 1683, 1992-11 |
| Throughput analysis for finite-buffered queueing networks with emphasis on the fork/join type = 분기 및 접합상태를 중심으로한 유한용량 대기행렬망의 산출률분석에 관한 연구link Paik, Chun-Hyun; 백천현; et al, 한국과학기술원, 1994 |
| Throughput analysis for open queueing networks = 개방 대기행렬망의 산출율 분석에 관한 연구link Paik, Chun-Hyun; 백천현; et al, 한국과학기술원, 1989 |
| Throughput analysis for queueing networks with finite capacities = 유한용량을 대기행렬망의 성능분석에 관한 연구link Lee, Won-Taek; 이원택; et al, 한국과학기술원, 1992 |
| Throughput analysis of 1x EV-DO system with multi cells Choi, Wan; Choi, D.; Lee, J.; Lee, S., IEICE International Technical Conference on Circuit/Systems, Computer, and Communications (ITC-CSCC), pp.1924 - 1927, ITC-CSCC, 2002-07-16 |
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