Showing results 213601 to 213620 of 279498
Via and reference discontinuity impact on high-speed signal integrity Kim J.; Kim, Joungho; Rotaru, M.D.; Chong, K.C.; Iyer, M.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.583 - 587, IEEE, 2004-08-09 |
Via filling for System in Packaging by using IMP, PVD, CVD, ALD and Electroplating Lee, Won-Jong; Cho, BH; Moon, JS, Pan Pacific Microelectronics Symposium, 2006-01-17 |
Via filling for system in packaging by using ionized metal plasma PVD and electroplating Lee, Won-Jong; Cho, Byung Hoon, Kyoto Joint Symposium on Materials Science and Engineering for the 21st Century, pp.88 - 88, 2004 |
Via Minimization Using Neural Networks S.S.Kim; C.M.Kyung, 전자공학회논문지, v.27, no.7, pp.129 - 136, 1990-07 |
VIA 상에서의 커널 수준 소켓 설계 및 구현 김진수, 한국정보과학회 컴퓨터시스템연구회 추계학술발표대회, 2003 |
VIA 상의 커널 수준 소켓 계층 설계와 구현 = Design and implementation of a kernel-level sockets layer over virtual interface architecturelink 장재완; Jang, Jae-Wan; et al, 한국과학기술원, 2004 |
VIA(Virtual Interface Architecture)를 기반으로 하는 소프트웨어 분산공유메모리 시스템의 설계 및 구현 맹승렬; 박소연; 김영재; 이상권, 한국정보과학회 학술대회, pp.0 - 0, 한국정보과학회, 2002-04-01 |
Via-hole filling을 위한 텅스텐 저압화학증착에 관한 연구 = A study on the low pressure chemical vapor deposition of tungsten for via-hole fillinglink 김일; Kim, Il; et al, 한국과학기술원, 1990 |
Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 |
Viability of E-coli cells containing phage RNA polymerase and promoter: interference of plasmid replication by transcription Kwon, YS; Kim, J; KANG, Changwon, GENETIC ANALYSIS-BIOMOLECULAR ENGINEERING, v.14, no.4, pp.133 - 139, 1998-10 |
Viability of internet ecosystem = 경쟁과 협력에 기반을 둔 인터넷의 기술적 지속성에 대한 연구link Lee, Hyojung; 이효정; et al, 한국과학기술원, 2017 |
Viability of Mouse Embryos Biopsied by a Squeeze Method Han, Yong-Mahn; Kim, Sun-Jung; Yoo, Ook-Joon; Lee, Kyung-Kwang, JOURNAL OF REPRODUCTION AND DEVELOPMENT, v.40, no.4, pp.323 - 328, 1994-11 |
Viability of shelf life extension of blueberries using a plasma pouch Kim, Jinwoo; Park, Sanghoo; Park, Joo Young; Choe, Wonho, XXXIV International Conference on Phenomena in Ionized Gases, The Chemical society of Japan, 2019-07-16 |
Viable and High-throughput Isolation of Heterogeneous Circulating Tumor Cells using Tapered-slit Filters Shim, Jae-Eul; Bu, Jiyoon; Lee, Mi-Kyung; Cho, Young-Ho; Kim, Tae-Ha; Bu, Jong-Uk; Han, Sae-Won, SENSORS AND ACTUATORS B-CHEMICAL, v.321, pp.128369, 2020-10 |
Viable Bacterial Cell Patterning Using a Pulsed Jet Electrospray System Chong, Eui-seok; Hwang, Gi Byung; Kim, Kyoung-Tae; Lee, Im-Soon; Han, Song Hee; Kim, Hyung Joo; Jung, Heehoon; et al, JOURNAL OF MICROBIOLOGY AND BIOTECHNOLOGY, v.25, no.3, pp.381 - 385, 2015-03 |
Viable capture and release of cancer cells in human whole blood Doh, Il; Yoo, Hwan-il; Cho, Young-Ho; Lee, Jinseon; Kim, Hong Kwan; Kim, Jhingook, APPLIED PHYSICS LETTERS, v.101, no.4, 2012-07 |
Vialess coplanar probe pad-to-microstrip transitions for 60 GHz-band LTCC applications Lee, Y.C.; Park, Chul Soon, 36th European Microwave Conference, EuMC 2006, pp.1354 - 1357, 2006-09-10 |
VIA를 이용한 RPC 성능 개선 김진수, 한국정보과학회 봄 학술발표논문집, 2001 |
VIA를 이용한 네트웍 블록 디바이스 김진수, 한국정보과학회 가을 학술발표논문집, 2001 |
VibAware: Context-Aware Tap and Swipe Gestures Using Bio-Acoustic Sensing Kim, Jina; Kim, Minyung; Lee, Woo Suk; Yoon, Sang Ho, 2023 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops, VRW 2023, pp.609 - 610, IEEE, 2023-03-25 |
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