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Showing results 1 to 3 of 3

1
Cure cycle for thick glass/epoxy composite laminates

Oh, JH; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.36, no.1, pp.19 - 45, 2002

2
Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01

3
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements

Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08

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