Browse by Subject JOINTS
Showing results 24 to 79 of 79
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates Yim, MJ; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.24, no.1, pp.24 - 32, 2001-03 |
| Effect of Surface Roughness on the Adhesive Strength of the Heat-Resistant Adhesive RTV88 Cho, Tae Min; Choo, Yeon Seok; Lee, Min Jung; Oh, Hyeon Cheol; Lee, Byung Chai; Park, Tae Hak; Shin, Young Sug, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.23, no.15, pp.1875 - 1882, 2009 |
| Effect of Zn on the intermetallics formation and reliability of Sn-3.5Ag solder on a Cu pad Jee, YK; Ko, YH; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.7, pp.1879 - 1887, 2007-07 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| Effects of microstructure and residual stress on fatigue crack growth of stainless steel narrow gap welds Jang, Changheui; Cho, Pyung-Yeon; Kim, Minu; Oh, Seung-Jin; Yang, Jun-Seog, MATERIALS & DESIGN, v.31, no.4, pp.1862 - 1870, 2010-04 |
| Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
| Effects of residual impurities in electroplated Cu on the Kirkendall void formation during soldering Kim, J. Y.; Yu, Jin, APPLIED PHYSICS LETTERS, v.92, no.9, 2008-03 |
| Effects of Solder Ball Geometry on Lap Shear Creep Rate Kim, Sung-Bum; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.3, pp.326 - 332, 2010-03 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Evaluation of CaO-Al2O3 adhesive bonding properties for beta ''-Al2O3 solid electrolyte sealing for alkali metal thermal electric converter Kim, Seyoung; Joo, Jong Hoon; Kim, Sun-Dong; Woo, Sang-Kuk, CERAMICS INTERNATIONAL, v.39, no.8, pp.9223 - 9227, 2013-12 |
| Evaluation of mechanical interlock effect on adhesion strength of polymer-metal interfaces using micro-patterned surface topography Kim, Won-Seock; Yun, Il-Han; Lee, Jungju; Jung, HeeTae, INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, v.30, no.6, pp.408 - 417, 2010-09 |
| Failure characterization of laser welds under combined loading conditions Ha, J.; Huh, Hoon, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.69, pp.40 - 58, 2013-04 |
| Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.69, no.3, pp.254 - 257, 2013-08 |
| Flame and silane treatments for improving the adhesive bonding characteristics of aramid/epoxy composites Kim, Jin-Gyu; Choi, Il-Beom; Lee, Dai-Gil; Seo, Il-Sung, COMPOSITE STRUCTURES, v.93, no.11, pp.2696 - 2705, 2011-10 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
| Formation of intermetallic compounds in the Ni bearing lead free composite solders Lee, JW; Lee, ZH; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2344 - 2350, 2005-11 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |
| Improvement of the adhesive peel strength of the secondary barrier with level difference for LNG containment system Yoon, Soon-Ho; Kim, Ki-Hyun; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.95, pp.528 - 538, 2013-01 |
Influence of Tensile Speeds on the Failure Loads of the DP590 Spot Weld under Various Combined Loading Conditions Song, Jung Han; Huh, Hoon, ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2015 |
| Interfacial bond behavior of FRP fabrics bonded to fiber-reinforced geopolymer mortar Khalida, Hammad Raza; Ha, S. K.; Park, S. M.; Kim, G. M.; Lee, Haeng-Ki, COMPOSITE STRUCTURES, v.134, pp.353 - 368, 2015-12 |
| Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
| Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate Yoon, SW; Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332, 1999 |
| Intermetallic compound spalling characteristics of Sn-3.5Ag solder over ternary electroless Ni under-bump metallurgy Jang, Dong-Min; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.26, no.24, pp.3032 - 3037, 2011-12 |
| Ladybird beetle-inspired compliant origami Baek, Sang-Min; Yim, Sojung; Chae, Soo-Hwan; Lee, Dae-Young; Cho, Kyu-Jin, SCIENCE ROBOTICS, v.5, no.41, 2020-04 |
| Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11 |
| Mechanically fastened composite side-door impact beams for passenger cars designed for shear-out failure modes Lim, TS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.56, no.2, pp.211 - 221, 2002-05 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| Noncontact laser ultrasonic inspection of weld defect in lithium-ion battery cap Choi, Seungjun; Liu, Peipei; Yi, Kiyoon; Sampath, Santhakumar; Sohn, Hoon, JOURNAL OF ENERGY STORAGE, v.73, 2023-12 |
| Numerical analysis of the damage behavior of an aluminum/CFRP hybrid beam under three point bending Shin, Dong Kil; Kim, Hee Chul; Lee, Jungju, COMPOSITES PART B-ENGINEERING, v.56, pp.397 - 407, 2014-01 |
| On the computation of the near-tip stress intensities for three-dimensional wedges via two-state M-integral Lee, Y; Im, Seyoung, JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, v.51, no.5, pp.825 - 850, 2003-05 |
| Optimization and reliability evaluation of COG bonding process Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03 |
| Peel strength improvement of foam core sandwich beams by epoxy resin impregnation on the foam surface Lee, CS; Lim, TS; Kwon, JW; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.5, pp.687 - 701, 2003 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| PREDICTION OF RESIDUAL STRESS-INDUCED CRACKING BY FINITE-ELEMENT ANALYSIS KWEON, SY; Choi, Si-Kyung, SCRIPTA METALLURGICA ET MATERIALIA, v.32, no.3, pp.359 - 364, 1995-02 |
| Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10 |
| Semi-active vibration control of space truss structures by friction damper for maximization of modal damping ratio Park, Young-min; Kim, Kwang-joon, JOURNAL OF SOUND AND VIBRATION, v.332, no.20, pp.4817 - 4828, 2013-09 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
| Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery Nam, Soohyun; Lee, Dongyoung; Choi, Ilbeom; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.120, pp.107 - 116, 2015-02 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
| Surface modification of carbon fiber/epoxy composites with randomly oriented aramid fiber felt for adhesion strength enhancement Choi, Ilbeom; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.48, pp.1 - 8, 2013-05 |
| The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| Trenchless repairing of underground pipes using RTM based on the axiomatic design method Chin, WS; Kwon, JW; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.37, no.12, pp.1109 - 1126, 2003 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| Use of Time-Series Predictive Models for Piezoelectric Active-Sensing in Structural Health Monitoring Applications Figueiredo, Eloi; Park, Gyuhae; Farinholt, Kevin M.; Farrar, Charles R.; Lee, Jung-Ryul, JOURNAL OF VIBRATION AND ACOUSTICS-TRANSACTIONS OF THE ASME, v.134, no.4, 2012-08 |
| Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
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- 31,008 2020 - 2024
- 99,997 2010 - 2019
- 75,669 2000 - 2009
- 44,727 1990 - 1999
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