Interfacial reaction between Sn-1Bi-5In-9Zn solder and Cu substrate
- Publisher
- Pergamon-Elsevier Science Ltd
- Issue Date
- 1999
- Language
- English
- Article Type
- Article
- Keywords
SN; DIFFUSION; SYSTEM; ALLOYS; JOINTS; COPPER
- Citation
SCRIPTA MATERIALIA, v.40, no.3, pp.327 - 332
- ISSN
- 1359-6462
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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