Showing results 1 to 1 of 1
A Tungsten Interlayer Process for Fabrication of Through-Pore AAO Scaffolds on Gold Substrates Oh, Jihun; Shin, Yong Cheol; Thompson, Carl V., JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.158, no.1, pp.11 - 15, 2011 |
Discover