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Analysis of local stresses in Si around Cu through-silicon via for 3D integrated circuit = 3차원 집적회로의 수직 관통 구리 전극 주변 실리콘 스트레스 특성 분석link Kim, Jae Hyun; 김재현; et al, 한국과학기술원, 2017 |
Non-destructive micro-Raman analysis of Si near Cu through silicon via Kim, Jae Hyun; Yoo, Woo Sik; Han, Seung Min, ELECTRONIC MATERIALS LETTERS, v.13, no.2, pp.120 - 128, 2017-03 |
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