Uniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes

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dc.contributor.authorJung, Jae-Ryungko
dc.contributor.authorYum, Bong-Jinko
dc.date.accessioned2013-03-11T06:12:47Z-
dc.date.available2013-03-11T06:12:47Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-05-
dc.identifier.citationINTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, v.54, no.5-8, pp.619 - 628-
dc.identifier.issn0268-3768-
dc.identifier.urihttp://hdl.handle.net/10203/98479-
dc.description.abstractIn this paper, the relationship between the uniformity measure (U) and the Taguchi signal-to-noise ratio (SNR) for parameter design (or robust design) is investigated with a focus on the deposition process. For the static parameter design, it can be easily shown that U is directly related to the Taguchi SNR, and, as such, U can be interpreted as a measure directly related to the expected loss after the mean thickness is adjusted to the target. For the dynamic parameter design in which the target of a characteristic (e.g., the target thickness for a deposition process) changes, the Taguchi SNR is conditional on the signal parameter values (e.g., the deposition times) used in the parameter design experiment. Therefore, a new performance measure is developed considering a general distribution of the target thickness, and it is shown that U is also equivalent to this new performance measure. In summary, U can be used as a valid performance measure for the dynamic as well as static parameter design of a deposition process. Based on these findings, static and dynamic parameter design procedures for a deposition process are developed considering not only U but also the deposition rate, and the proposed dynamic procedure is illustrated with an example case study.-
dc.languageEnglish-
dc.publisherSPRINGER LONDON LTD-
dc.subjectROBUST DESIGN-
dc.subjectSILICON-NITRIDE-
dc.subjectOPTIMIZATION-
dc.titleUniformity and signal-to-noise ratio for static and dynamic parameter designs of deposition processes-
dc.typeArticle-
dc.identifier.wosid000290164500017-
dc.identifier.scopusid2-s2.0-79955657468-
dc.type.rimsART-
dc.citation.volume54-
dc.citation.issue5-8-
dc.citation.beginningpage619-
dc.citation.endingpage628-
dc.citation.publicationnameINTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY-
dc.contributor.localauthorYum, Bong-Jin-
dc.contributor.nonIdAuthorJung, Jae-Ryung-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorUniformity-
dc.subject.keywordAuthorSignal-to-noise ratio-
dc.subject.keywordAuthorParameter design-
dc.subject.keywordAuthorRobust design-
dc.subject.keywordAuthorDeposition process-
dc.subject.keywordPlusROBUST DESIGN-
dc.subject.keywordPlusSILICON-NITRIDE-
dc.subject.keywordPlusOPTIMIZATION-
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