Thermowetting embossing nanoimprinting of the organic-inorganic hybrid materials

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dc.contributor.authorKim, WSko
dc.contributor.authorKim, KSko
dc.contributor.authorKim, YCko
dc.contributor.authorBae, Byeong-Sooko
dc.date.accessioned2009-06-23T02:17:42Z-
dc.date.available2009-06-23T02:17:42Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2005-04-
dc.identifier.citationTHIN SOLID FILMS, v.476, no.1, pp.181 - 184-
dc.identifier.issn0040-6090-
dc.identifier.urihttp://hdl.handle.net/10203/9682-
dc.description.abstractA new UV-based soft-lithographic technique for submicron patterns via thermowetting of organic-inorganic hybrid materials is described. Specifically, 300-nm scale patterns were replicated utilising this coating-free fabrication method. With thermowetting embossing nanoimprinting technique, a poly(dimethyl siloxane) (PDMS) mold with a submicron-scale relief was placed on a thermally wetted organic-inorganic hybrid material, which was then polymerized with UV light. The thermowetting embossing nanoimprinting technique can be applied universally to patternable organic-inorganic hybrid materials, such as methacrylic and vinylic organic-inorganic hybrid materials. Fabricated submicron patterns can also be applied to the nanoscale patterning, e.g., arrayed photonic band gap materials. (c) 2004 Elsevier B.V. All rights reserved.-
dc.description.sponsorshipThis work was supported financially by the Sol–Gel Innovation Project (SOLIP) from the Ministry of Commerce, Industry and Energy of Korea and also partially by the Brain Korea 21 project from the Ministry of Education and Human Resources Development of Korea.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherELSEVIER SCIENCE SA-
dc.subjectIMPRINT LITHOGRAPHY-
dc.titleThermowetting embossing nanoimprinting of the organic-inorganic hybrid materials-
dc.typeArticle-
dc.identifier.wosid000227509100027-
dc.identifier.scopusid2-s2.0-13844296949-
dc.type.rimsART-
dc.citation.volume476-
dc.citation.issue1-
dc.citation.beginningpage181-
dc.citation.endingpage184-
dc.citation.publicationnameTHIN SOLID FILMS-
dc.identifier.doi10.1016/j.tsf.2004.09.026-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorBae, Byeong-Soo-
dc.contributor.nonIdAuthorKim, WS-
dc.contributor.nonIdAuthorKim, KS-
dc.contributor.nonIdAuthorKim, YC-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorsilicon oxide-
dc.subject.keywordAuthorwetting-
dc.subject.keywordAuthornano sturctures-
dc.subject.keywordPlusIMPRINT LITHOGRAPHY-
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