DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, WS | ko |
dc.contributor.author | Kim, KS | ko |
dc.contributor.author | Kim, YC | ko |
dc.contributor.author | Bae, Byeong-Soo | ko |
dc.date.accessioned | 2009-06-23T02:17:42Z | - |
dc.date.available | 2009-06-23T02:17:42Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-04 | - |
dc.identifier.citation | THIN SOLID FILMS, v.476, no.1, pp.181 - 184 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://hdl.handle.net/10203/9682 | - |
dc.description.abstract | A new UV-based soft-lithographic technique for submicron patterns via thermowetting of organic-inorganic hybrid materials is described. Specifically, 300-nm scale patterns were replicated utilising this coating-free fabrication method. With thermowetting embossing nanoimprinting technique, a poly(dimethyl siloxane) (PDMS) mold with a submicron-scale relief was placed on a thermally wetted organic-inorganic hybrid material, which was then polymerized with UV light. The thermowetting embossing nanoimprinting technique can be applied universally to patternable organic-inorganic hybrid materials, such as methacrylic and vinylic organic-inorganic hybrid materials. Fabricated submicron patterns can also be applied to the nanoscale patterning, e.g., arrayed photonic band gap materials. (c) 2004 Elsevier B.V. All rights reserved. | - |
dc.description.sponsorship | This work was supported financially by the Sol–Gel Innovation Project (SOLIP) from the Ministry of Commerce, Industry and Energy of Korea and also partially by the Brain Korea 21 project from the Ministry of Education and Human Resources Development of Korea. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | IMPRINT LITHOGRAPHY | - |
dc.title | Thermowetting embossing nanoimprinting of the organic-inorganic hybrid materials | - |
dc.type | Article | - |
dc.identifier.wosid | 000227509100027 | - |
dc.identifier.scopusid | 2-s2.0-13844296949 | - |
dc.type.rims | ART | - |
dc.citation.volume | 476 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 181 | - |
dc.citation.endingpage | 184 | - |
dc.citation.publicationname | THIN SOLID FILMS | - |
dc.identifier.doi | 10.1016/j.tsf.2004.09.026 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Bae, Byeong-Soo | - |
dc.contributor.nonIdAuthor | Kim, WS | - |
dc.contributor.nonIdAuthor | Kim, KS | - |
dc.contributor.nonIdAuthor | Kim, YC | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | silicon oxide | - |
dc.subject.keywordAuthor | wetting | - |
dc.subject.keywordAuthor | nano sturctures | - |
dc.subject.keywordPlus | IMPRINT LITHOGRAPHY | - |
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