2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ukaegbu, Ikechi Augustine | ko |
| dc.contributor.author | Kim, Do-Won | ko |
| dc.contributor.author | Cho, Mu-Hee | ko |
| dc.contributor.author | Lee, Tae-Woo | ko |
| dc.contributor.author | Park, Hyo-Hoon | ko |
| dc.date.accessioned | 2013-03-09T03:40:08Z | - |
| dc.date.available | 2013-03-09T03:40:08Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-10 | - |
| dc.identifier.citation | IEEE PHOTONICS TECHNOLOGY LETTERS, v.23, no.19, pp.1403 - 1405 | - |
| dc.identifier.issn | 1041-1135 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/95267 | - |
| dc.description.abstract | We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10(-12) and can be used for optical interconnections in OPCBs. | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.subject | INTERCONNECTION | - |
| dc.title | 2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000297544800008 | - |
| dc.identifier.scopusid | 2-s2.0-80052872822 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 23 | - |
| dc.citation.issue | 19 | - |
| dc.citation.beginningpage | 1403 | - |
| dc.citation.endingpage | 1405 | - |
| dc.citation.publicationname | IEEE PHOTONICS TECHNOLOGY LETTERS | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Park, Hyo-Hoon | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | Flip-chip bonding | - |
| dc.subject.keywordAuthor | long wavelength vertical-cavity surface-emitting laser (VCSEL) | - |
| dc.subject.keywordAuthor | optical interconnection | - |
| dc.subject.keywordAuthor | optical printed-circuit board (OPCB) | - |
| dc.subject.keywordAuthor | short wavelength VCSEL | - |
| dc.subject.keywordAuthor | silicon complementary metal-oxide-semiconductor (Si-CMOS) driver integrated circuit (IC) | - |
| dc.subject.keywordPlus | INTERCONNECTION | - |
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