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College of Engineering(공과대학)Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)NE-Journal Papers(저널논문)

Copper Seed Layer Deposition by a New Liquid Precursor

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dc.contributor.authorKang, Sang-Wooko
dc.contributor.authorShin, Yong-Hyeonko
dc.contributor.authorKim, Jin-Taeko
dc.contributor.authorYun, Ju-Youngko
dc.contributor.authorChang, Yun-Heeko
dc.contributor.authorYang, Il-Dooko
dc.date.accessioned2013-03-08T20:45:55Z-
dc.date.available2013-03-08T20:45:55Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-03-
dc.identifier.citationCHEMICAL VAPOR DEPOSITION, v.17, no.1-3, pp.65 - 68-
dc.identifier.issn0948-1907-
dc.identifier.urihttp://hdl.handle.net/10203/94246-
dc.description.abstractCu(hfac)(2)(TEA) (hfac 1,1,1,5,5,5-hexafluoroacetylacetonate, TEA (triethylamine, N(C(2)H(5))(3))) is a new liquid Cu(II) precursor. Using Cu(hfac)(2)(TEA), we successfully deposit Cu thin films as a seed layer, even at the low deposition temperature of 373 K. To explain this behavior, the bonding status of Cu(hfac)(2) in the presence of TEA is determined by density-functional theory. The theoretical bond length of Cu-O in Cu(hfac)(2) is significantly greater (by 0.06 angstrom) than that without an adduct ligand.-
dc.languageEnglish-
dc.publisherWILEY-BLACKWELL-
dc.subjectCHEMICAL-VAPOR-DEPOSITION-
dc.subjectFILMS-
dc.subjectPSEUDOPOTENTIALS-
dc.subjectREACTOR-
dc.subjectEPITAXY-
dc.subjectCU-
dc.titleCopper Seed Layer Deposition by a New Liquid Precursor-
dc.typeArticle-
dc.identifier.wosid000288563500010-
dc.identifier.scopusid2-s2.0-79952750264-
dc.type.rimsART-
dc.citation.volume17-
dc.citation.issue1-3-
dc.citation.beginningpage65-
dc.citation.endingpage68-
dc.citation.publicationnameCHEMICAL VAPOR DEPOSITION-
dc.identifier.doi10.1002/cvde.201006899-
dc.contributor.nonIdAuthorKang, Sang-Woo-
dc.contributor.nonIdAuthorShin, Yong-Hyeon-
dc.contributor.nonIdAuthorKim, Jin-Tae-
dc.contributor.nonIdAuthorYun, Ju-Young-
dc.contributor.nonIdAuthorYang, Il-Doo-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorCopper-
dc.subject.keywordAuthorPrecursors-
dc.subject.keywordAuthorThermal CVD-
dc.subject.keywordAuthorDensity functional theory-
dc.subject.keywordPlusCHEMICAL-VAPOR-DEPOSITION-
dc.subject.keywordPlusFILMS-
dc.subject.keywordPlusPSEUDOPOTENTIALS-
dc.subject.keywordPlusREACTOR-
dc.subject.keywordPlusEPITAXY-
dc.subject.keywordPlusCU-
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