Finite Element Modeling of Multi-Scale Thermal Contact Resistance

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dc.contributor.authorThompson, Mary Kathrynko
dc.date.accessioned2009-06-12T03:39:00Z-
dc.date.available2009-06-12T03:39:00Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-01-06-
dc.identifier.citation1st ASME Micro/Nanoscale Heat Transfer International Conference, MNHT08, pp.509 - 517-
dc.identifier.urihttp://hdl.handle.net/10203/9345-
dc.description.sponsorshipThe author would like to thank Prof. Alexander H. Slocum for his advice, support and many conversations about this work; Dr. John M. Thompson for his collaboration in developing the post-processing tools and surface importation methods used in this work; Karta Khalsa from Zygo, Inc. for his collaboration in developing the surface data translation tool used in this work; ANSYS, Inc. for donating the software used in this work; and Berk Yesin and ABB, Ltd. for their support of this work.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherASME-
dc.titleFinite Element Modeling of Multi-Scale Thermal Contact Resistance-
dc.typeConference-
dc.identifier.wosid000255392000071-
dc.identifier.scopusid2-s2.0-49449095462-
dc.type.rimsCONF-
dc.citation.beginningpage509-
dc.citation.endingpage517-
dc.citation.publicationname1st ASME Micro/Nanoscale Heat Transfer International Conference, MNHT08-
dc.identifier.conferencecountryCH-
dc.identifier.conferencelocationTainan-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorThompson, Mary Kathryn-
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CE-Conference Papers(학술회의논문)
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