DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, IH | ko |
dc.contributor.author | Park, TS | ko |
dc.contributor.author | Yang, SY | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.date.accessioned | 2013-03-08T03:12:54Z | - |
dc.date.available | 2013-03-08T03:12:54Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836 | - |
dc.identifier.issn | 1013-9826 | - |
dc.identifier.uri | http://hdl.handle.net/10203/91958 | - |
dc.description.abstract | Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life. | - |
dc.language | English | - |
dc.publisher | TRANS TECH PUBLICATIONS LTD | - |
dc.subject | RELIABILITY | - |
dc.title | A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints | - |
dc.type | Article | - |
dc.identifier.wosid | 000233131201024 | - |
dc.identifier.scopusid | 2-s2.0-33847301801 | - |
dc.type.rims | ART | - |
dc.citation.volume | 297-300 | - |
dc.citation.beginningpage | 831 | - |
dc.citation.endingpage | 836 | - |
dc.citation.publicationname | ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Kim, IH | - |
dc.contributor.nonIdAuthor | Park, TS | - |
dc.contributor.nonIdAuthor | Yang, SY | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | power cycling | - |
dc.subject.keywordAuthor | lead free solder | - |
dc.subject.keywordAuthor | fatigue | - |
dc.subject.keywordAuthor | FEM | - |
dc.subject.keywordPlus | RELIABILITY | - |
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