Application of RF varactor using BaxSr1-xTiO3/TiO2/HR-Si substrate for reconfigurable radio

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dc.contributor.authorKim, KBko
dc.contributor.authorPark, Chul Soonko
dc.date.accessioned2013-03-08T00:45:20Z-
dc.date.available2013-03-08T00:45:20Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-11-
dc.identifier.citationIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, v.54, pp.2227 - 2232-
dc.identifier.issn0885-3010-
dc.identifier.urihttp://hdl.handle.net/10203/91632-
dc.description.abstractIn this paper, the potential feasibility of integrating BaxSr1-xTiO3 (BST) films into Si wafer by adopting tunable interdigital capacitor (IDC) with TiO2 thin film buffer layer and a RF tunable active bandpass filter (BPF) using BST based capacitor are proposed. TiO2 as a buffer layer is grown onto Si substrate by atomic layer deposition (ALD) and the interdigital capacitor on BST(500 nm)/TiO2(50 nm)/HR-Si is fabricated. BST interdigital tunable capacitor integrated on HR-Si substrate with high tunability and low loss tangent are characterized for their microwave performances. BST/TiO2/HRSi IDC shows much enhanced tunability values of 40% and commutation quality factor (CQF) of 56.71. A resonator consists of an active capacitance circuit together with a BST varactor. The active capacitor is made of a field effect transistor (FET) that exhibits negative resistance as well as capacitance. The measured second order active BPF shows bandwidth of 110 MHz, insertion loss of about 1 dB at the 1.81 GHz center frequency and tuning frequency of 230 MHz (1.81-2.04 GHz).-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleApplication of RF varactor using BaxSr1-xTiO3/TiO2/HR-Si substrate for reconfigurable radio-
dc.typeArticle-
dc.identifier.wosid000250789400002-
dc.identifier.scopusid2-s2.0-37049020665-
dc.type.rimsART-
dc.citation.volume54-
dc.citation.beginningpage2227-
dc.citation.endingpage2232-
dc.citation.publicationnameIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL-
dc.identifier.doi10.1109/TUFFC.2007.527-
dc.contributor.localauthorPark, Chul Soon-
dc.contributor.nonIdAuthorKim, KB-
dc.type.journalArticleArticle-
dc.subject.keywordPlusTHIN-FILMS-
dc.subject.keywordPlusHIGH TUNABILITY-
dc.subject.keywordPlusBUFFER LAYERS-
dc.subject.keywordPlusFILTER-
dc.subject.keywordPlusINTEGRATION-
dc.subject.keywordPlusTA2O5-
dc.subject.keywordPlusTIO2-
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