A 10 X 21 X I nuns very compact low temperature cofired ceramic (LTCC) system-in-package (SiP) transmitter module is presented for future wireless terminal applications. Five GaAs monolithic microwave integrated circuits (MMIC) chipsets including a power amplifier, driver amplifier, mixer, and two frequency multipliers are integrated into a LTCC multilayer circuit for the heterodyne transmitter. The fabricated transmitter module achieves an output of 13 dBm at a RF frequency of 62 GHz, an IF frequency of 2.4 GHz, and an local oscillator frequency of 59.6 GHz. The up-conversion gain is I I dB; while the local oscillator Signal is suppressed below -20.6 dBc with the image rejection mixer, and the image and spurious signals are also suppressed below -29.6 dBc. (c) 2007 Wiley Periodicals, Inc.