DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, KM | ko |
dc.contributor.author | Sohn, B | ko |
dc.contributor.author | Yook, JM | ko |
dc.contributor.author | Yeo, SK | ko |
dc.contributor.author | Kwon, Young Se | ko |
dc.date.accessioned | 2013-03-06T20:58:08Z | - |
dc.date.available | 2013-03-06T20:58:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-03 | - |
dc.identifier.citation | ELECTRONICS LETTERS, v.43, no.6, pp.325 - 327 | - |
dc.identifier.issn | 0013-5194 | - |
dc.identifier.uri | http://hdl.handle.net/10203/88438 | - |
dc.description.abstract | Proposed is a new type of packaging technology, 'pocket embedding package', using selectively anodised aluminium substrate. In this technology, chips can be embedded inside aluminium substrate so that an ultra-thin and compact type of package can be achieved. A monolithic microwave integrated circuit dice with 120 mu m thickness has been successfully embedded inside the substrate with a tolerance of less than 5 pm, and 300 mu m of total thickness can be achieved with excellent thermal dissipation. | - |
dc.language | English | - |
dc.publisher | INSTITUTION ENGINEERING TECHNOLOGY-IET | - |
dc.title | Ultra-thin pocket embedding package for system in package | - |
dc.type | Article | - |
dc.identifier.wosid | 000245606500009 | - |
dc.identifier.scopusid | 2-s2.0-34047146477 | - |
dc.type.rims | ART | - |
dc.citation.volume | 43 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 325 | - |
dc.citation.endingpage | 327 | - |
dc.citation.publicationname | ELECTRONICS LETTERS | - |
dc.identifier.doi | 10.1049/el:20073758 | - |
dc.contributor.localauthor | Kwon, Young Se | - |
dc.contributor.nonIdAuthor | Kim, KM | - |
dc.contributor.nonIdAuthor | Sohn, B | - |
dc.contributor.nonIdAuthor | Yook, JM | - |
dc.contributor.nonIdAuthor | Yeo, SK | - |
dc.type.journalArticle | Article | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.