Mechanical Fatigue Testings of BGA Type Solder Joints
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Ham, Suk-Jin | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-06T18:52:38Z | - |
| dc.date.available | 2013-03-06T18:52:38Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006 | - |
| dc.identifier.citation | EXPERIMENTAL MECHANICS | - |
| dc.identifier.issn | 0014-4851 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/88030 | - |
| dc.language | English | - |
| dc.publisher | Springer | - |
| dc.title | Mechanical Fatigue Testings of BGA Type Solder Joints | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.publicationname | EXPERIMENTAL MECHANICS | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ham, Suk-Jin | - |
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- ME-Journal Papers(저널논문)
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