Active packaging method for light-emitting diode lamps with photosensitive epoxy resins
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Wang, H | ko |
| dc.contributor.author | Lee, KS | ko |
| dc.contributor.author | Ryu, JH | ko |
| dc.contributor.author | Hong, CH | ko |
| dc.contributor.author | Cho, Yong-Hoon | ko |
| dc.date.accessioned | 2013-03-06T12:11:31Z | - |
| dc.date.available | 2013-03-06T12:11:31Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-01 | - |
| dc.identifier.citation | IEEE PHOTONICS TECHNOLOGY LETTERS, v.20, pp.87 - 89 | - |
| dc.identifier.issn | 1041-1135 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/86949 | - |
| dc.description.abstract | A novel active light-emitting diode (LED), packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminates the utilization of the mold. By controlling the packaging parameters, for example, the polymerization current and the polymerization time, the emission properties of the LED lamps can be controlled. It is found that the self-focusing effect plays an important role in the active packaging process. | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.subject | ENCAPSULANT | - |
| dc.title | Active packaging method for light-emitting diode lamps with photosensitive epoxy resins | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000253225300028 | - |
| dc.identifier.scopusid | 2-s2.0-41049090769 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 20 | - |
| dc.citation.beginningpage | 87 | - |
| dc.citation.endingpage | 89 | - |
| dc.citation.publicationname | IEEE PHOTONICS TECHNOLOGY LETTERS | - |
| dc.identifier.doi | 10.1109/LPT.2007.910760 | - |
| dc.contributor.localauthor | Cho, Yong-Hoon | - |
| dc.contributor.nonIdAuthor | Wang, H | - |
| dc.contributor.nonIdAuthor | Lee, KS | - |
| dc.contributor.nonIdAuthor | Ryu, JH | - |
| dc.contributor.nonIdAuthor | Hong, CH | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | encapsulation | - |
| dc.subject.keywordAuthor | light-emitting diode (LED) | - |
| dc.subject.keywordAuthor | photosensitive epoxy resins | - |
| dc.subject.keywordAuthor | semiconductor device packaging | - |
| dc.subject.keywordPlus | ENCAPSULANT | - |
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