Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system

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dc.contributor.authorSeo, Sun-Kyoungko
dc.contributor.authorCho, Moon Giko
dc.contributor.authorLee, HyuckMoko
dc.date.accessioned2013-03-06T11:16:47Z-
dc.date.available2013-03-06T11:16:47Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-11-
dc.identifier.citationJOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10203/86790-
dc.description.abstractAs a basis to understand the interfacial reaction between the Sn-Bi solder and the Ni substrate in electronic packaging, thermodynamic calculations of phase equilibria have been carried out on the binary Ni-Bi system. The Gibbs free energy of the NiBi phase has been approximated, using a three-sublattice model, and thermodynamic parameters have been evaluated, using available experimental information on phase boundaries and other related thermodynamic properties. The calculated phase diagram and thermodynamic quantities of the Ni-Bi binary system showed good agreement with the experimental data. The Sn-Bi-Ni ternary system was calculated using the thermodynamic parameters of the Sn-Bi, Sn-Ni, and Ni-Bi binary systems, and it was compared with experimental measurements.-
dc.languageEnglish-
dc.publisherSpringer-
dc.subjectNICKEL-BISMUTH-
dc.subjectINTERFACIAL REACTIONS-
dc.subjectSOLDER ALLOYS-
dc.subjectSUBSTRATE-
dc.subjectCU-
dc.titleThermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system-
dc.typeArticle-
dc.identifier.wosid000250340700019-
dc.identifier.scopusid2-s2.0-35248862565-
dc.type.rimsART-
dc.citation.volume36-
dc.citation.issue11-
dc.citation.beginningpage1536-
dc.citation.endingpage1544-
dc.citation.publicationnameJOURNAL OF ELECTRONIC MATERIALS-
dc.contributor.localauthorLee, HyuckMo-
dc.contributor.nonIdAuthorSeo, Sun-Kyoung-
dc.contributor.nonIdAuthorCho, Moon Gi-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthorNi-Bi system-
dc.subject.keywordAuthorthermodynamic assessment-
dc.subject.keywordAuthorSn-Bi-Ni system-
dc.subject.keywordAuthorequilibria-
dc.subject.keywordPlusNICKEL-BISMUTH-
dc.subject.keywordPlusINTERFACIAL REACTIONS-
dc.subject.keywordPlusSOLDER ALLOYS-
dc.subject.keywordPlusSUBSTRATE-
dc.subject.keywordPlusCU-
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