DC Field | Value | Language |
---|---|---|
dc.contributor.author | Noh, CH | ko |
dc.contributor.author | Son, HJ | ko |
dc.contributor.author | Kim, JY | ko |
dc.contributor.author | Hwang, OC | ko |
dc.contributor.author | Song, KY | ko |
dc.contributor.author | Byk, TV | ko |
dc.contributor.author | Sokolov, VG | ko |
dc.contributor.author | Kim, Jin-Baek | ko |
dc.date.accessioned | 2013-03-06T10:07:59Z | - |
dc.date.available | 2013-03-06T10:07:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-01 | - |
dc.identifier.citation | CHEMISTRY LETTERS, v.34, no.1, pp.82 - 83 | - |
dc.identifier.issn | 0366-7022 | - |
dc.identifier.uri | http://hdl.handle.net/10203/86645 | - |
dc.description.abstract | Photocatalytic layers of amorphous TiO2 and polyvinyl alcohol were used for the patterning of low-resistivity metals such as copper and silver without using high cost materials and equipment. | - |
dc.language | English | - |
dc.publisher | CHEMICAL SOC JAPAN | - |
dc.subject | THIN-FILM | - |
dc.subject | COPPER | - |
dc.title | A novel patterning method of low-resistivity metals | - |
dc.type | Article | - |
dc.identifier.wosid | 000226325600037 | - |
dc.identifier.scopusid | 2-s2.0-17144420897 | - |
dc.type.rims | ART | - |
dc.citation.volume | 34 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 82 | - |
dc.citation.endingpage | 83 | - |
dc.citation.publicationname | CHEMISTRY LETTERS | - |
dc.identifier.doi | 10.1246/cl.2005.82 | - |
dc.contributor.localauthor | Kim, Jin-Baek | - |
dc.contributor.nonIdAuthor | Noh, CH | - |
dc.contributor.nonIdAuthor | Son, HJ | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Hwang, OC | - |
dc.contributor.nonIdAuthor | Song, KY | - |
dc.contributor.nonIdAuthor | Byk, TV | - |
dc.contributor.nonIdAuthor | Sokolov, VG | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | THIN-FILM | - |
dc.subject.keywordPlus | COPPER | - |
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