박판 몰드를 이용한 솔더 범프 패턴의 형성 공정Fabrication of Solder Bump Pattern Using Thin Mold

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Publisher
대한용접접합학회
Issue Date
2007-04
Language
Korean
Citation

대한용접접합학회지, v.25, no.2, pp.76 - 81

ISSN
1225-6153
URI
http://hdl.handle.net/10203/86253
Appears in Collection
ME-Journal Papers(저널논문)
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