레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가Evaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry
- Publisher
- 대한금속∙재료학회지
- Issue Date
- 2002-09
- Language
- Korean
- Citation
대한금속∙재료학회지, v.40, no.9, pp.995 - 1000
- ISSN
- 1738-8228
- Appears in Collection
- MS-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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