레이저 간섭계(ESPI)를 이용한 플립칩 패키지의 열변형 평가Evaluation of Thermal Deformations in Flip-Chip Package Using Electronic Speckle Pattern Interferometry

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 306
  • Download : 0
Publisher
대한금속∙재료학회지
Issue Date
2002-09
Language
Korean
Citation

대한금속∙재료학회지, v.40, no.9, pp.995 - 1000

ISSN
1738-8228
URI
http://hdl.handle.net/10203/81426
Appears in Collection
MS-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0