MOS characteristics of substituted Al gate on high-kappa dielectric

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dc.contributor.authorPark, CSko
dc.contributor.authorCho, Byung Jinko
dc.contributor.authorKwong, DLko
dc.date.accessioned2013-03-03T19:02:59Z-
dc.date.available2013-03-03T19:02:59Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2004-11-
dc.identifier.citationIEEE ELECTRON DEVICE LETTERS, v.25, no.11, pp.725 - 727-
dc.identifier.issn0741-3106-
dc.identifier.urihttp://hdl.handle.net/10203/80014-
dc.description.abstractSubstituted aluminum (SA) metal gate on high-kappa gate dielectric is successfully demonstrated. Full substitution of polysilicon with Al is achieved for a Ti-Al-polysilicon-HfAlON gate structure by a low-temperature annealing at 450 degreesC. The SA gate on HfAlON dielectric shows a very low work function of 4.25 eV, which is well suitable for bulk nMOSFETs. The SA process is fully free from the Fermi-level pinning problem. In addition, the SA process also shows improved uniformity in leakage current distribution compared to fully silicided metal gate.-
dc.languageEnglish-
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.titleMOS characteristics of substituted Al gate on high-kappa dielectric-
dc.typeArticle-
dc.identifier.wosid000224712000005-
dc.identifier.scopusid2-s2.0-8344247768-
dc.type.rimsART-
dc.citation.volume25-
dc.citation.issue11-
dc.citation.beginningpage725-
dc.citation.endingpage727-
dc.citation.publicationnameIEEE ELECTRON DEVICE LETTERS-
dc.identifier.doi10.1109/led.2004.837537-
dc.contributor.localauthorCho, Byung Jin-
dc.contributor.nonIdAuthorPark, CS-
dc.contributor.nonIdAuthorKwong, DL-
dc.type.journalArticleArticle-
dc.subject.keywordAuthoraluminum-
dc.subject.keywordAuthorCMOS-
dc.subject.keywordAuthorfully silicided (FUSI)-
dc.subject.keywordAuthorhigh-kappa-
dc.subject.keywordAuthormetal gate-
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