Aluminum-based packaging platform for LED using selectively anodising method

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 374
  • Download : 0
DC FieldValueLanguage
dc.contributor.authork. m. kimko
dc.contributor.authors. h. shinko
dc.contributor.authory. k. leeko
dc.contributor.authors. m. choiko
dc.contributor.authorKwon, Young Seko
dc.date.accessioned2013-03-03T17:06:42Z-
dc.date.available2013-03-03T17:06:42Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2001-
dc.identifier.citationELECTRONICS LETTERS, v.44, no.1-
dc.identifier.issn0013-5194-
dc.identifier.urihttp://hdl.handle.net/10203/79607-
dc.languageEnglish-
dc.publisherInst Engineering Technology-Iet-
dc.titleAluminum-based packaging platform for LED using selectively anodising method-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume44-
dc.citation.issue1-
dc.citation.publicationnameELECTRONICS LETTERS-
dc.contributor.localauthorKwon, Young Se-
dc.contributor.nonIdAuthork. m. kim-
dc.contributor.nonIdAuthors. h. shin-
dc.contributor.nonIdAuthory. k. lee-
dc.contributor.nonIdAuthors. m. choi-
Appears in Collection
EE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0