Scheduling analysis of time-constrained dual-armed cluster tools

Cited 197 time in webofscience Cited 0 time in scopus
  • Hit : 732
  • Download : 991
Cluster tools, each of which consists of several single-wafer processing chambers and a wafer handling robot, have been increasingly used for diverse wafer fabrication processes. Processes such as some low pressure chemical vapor deposition processes require strict timing control. Unless a wafer processed at a chamber for such a process leaves the chamber within a specified time limit, the wafer is subject to quality problems due to residual gases and heat. We address the scheduling problem for such time-constrained dual-armed cluster tools that have diverse wafer flow patterns. We propose a systematic method of determining the schedulable process time range for which there exists a feasible schedule that satisfies the time constraints. We explain how to select the desirable process times within the schedulable process time range. We present a method of determining the tool operation schedule. For more flexible scheduling under the time constraints, we propose a modification of the conventional swap operation in order to allow wafer delay on a robot arm during a swap operation. We compare the performance of the new swap strategy with that of the conventional swap strategy.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2003-08
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.16, no.3, pp.521 - 534

ISSN
0894-6507
URI
http://hdl.handle.net/10203/7394
Appears in Collection
IE-Journal Papers(저널논문)
Files in This Item
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 197 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0